It appears from the disassembled 35S photos That HP is using chip face down assembly. When I look at the circuit traces I see some dissapear without a plated thruogh hole. Can someone enlighten me as to there chip assembly method. Ultrasonic? Are there also bond wires? It seems to have too many PC leads to connect them all in one bonding. What happens when the traces seem to disappear?
Thanks, Sam Levy
http://www.finetune.jp/~lyuka/interests/calc/hp35s/hp35s-disassembled.html
HP35S ASSEMBLY METHODS
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